公开(公告)号：US5617289A

公开(公告)日：1997-04-01

申请号：US463391

申请日：1995-06-05

申请人： Samir E. Abboud ,  Nickolas C. Apuzzo ,  Jeffrey B. Brown ,  Earl A. Cunningham ,  David M. Hannon ,  Raymond P. Mallette ,  Paul S. Tyler ,  Steven H. Voss ,  Albert J. Wallash

发明人： Samir E. Abboud ,  Nickolas C. Apuzzo ,  Jeffrey B. Brown ,  Earl A. Cunningham ,  David M. Hannon ,  Raymond P. Mallette ,  Paul S. Tyler ,  Steven H. Voss ,  Albert J. Wallash

IPC分类号： G11B5/00 ,  G11B5/39 ,  G11B5/465 ,  G11B5/48 ,  H01L43/12 ,  H01F13/00

CPC分类号： G11B5/3903 ,  G11B5/465 ,  G11B5/4886 ,  G11B2005/0008 ,  Y10T29/49034

摘要： The magnetic states of MR reproducing heads are reinitialized during media drive manufacturing by applying initializing magnetic fields to the transducers after they have been manufactured and incorporated into media drive assemblies.

摘要翻译： 磁记录磁头的磁状态在介质驱动制造过程中被重新初始化，通过在传感器被制造并且被并入到介质驱动组件中之后对其进行初始化磁场。

公开(公告)号：US07218984B1

公开(公告)日：2007-05-15

申请号：US11275176

申请日：2005-12-16

申请人： Benjamin R. Bayat ,  Raymond P. Mallette ,  James G. Michael ,  Kathleen G. Purdy

发明人： Benjamin R. Bayat ,  Raymond P. Mallette ,  James G. Michael ,  Kathleen G. Purdy

IPC分类号： G06F19/00

CPC分类号： G05B19/41875 ,  G05B2219/45031 ,  Y02P90/22

摘要： A yield expectation determination is dynamically provided during manufacturing of a lot of integrated circuits. In one embodiment, the determination includes initially establishing a yield expectation for a lot, which can be based on a process grade, and adjusting the yield expectation during manufacturing based on test data from the kerf of a wafer. In addition, the yield expectation can be adjusted based on inspection data from optical and SEM inspection tools during manufacturing. Correlation coefficient models that correlate kerf data and inspection data to a yield expectation adjustment are used to dynamically adjust the yield expectation, resulting in a more accurate yield projection during manufacturing. The correlation coefficient models and/or process grade estimates are updated based on actual yield from a previous lot, thus further improving yield expectation accuracy.

摘要翻译： 在大量集成电路的制造过程中动态提供产量预期确定。 在一个实施方案中，确定包括最初建立批次的产量期望，其可以基于工艺等级，并且基于来自晶片的切口的测试数据来调整制造期间的产量期望。 此外，可以根据制造过程中的光学和扫描电镜检查工具的检查数据来调整产量预期。 将切割数据和检验数据与产量预期调整相关联的相关系数模型用于动态调整产量期望，从而在制造过程中产生更准确的产量投影。 相关系数模型和/或过程等级估计根据以前批次的实际收益率进行更新，从而进一步提高产量期望准确度。