DISPLAY DEVICE
    1.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20200333655A1

    公开(公告)日:2020-10-22

    申请号:US16821719

    申请日:2020-03-17

    Abstract: A display device includes: a first substrate having a first area; a second substrate having a second area larger than the first area and positioned above the first substrate; interconnects on the first substrate; connection pads on a side surface of the first substrate and electrically connected to the interconnects; and a first cover member on the side surface of the first substrate, wherein a side surface of the second substrate protrudes from the side surface of the first substrate in a first direction, and the first cover member is located under the second substrate.

    DISPLAY DEVICE
    2.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20240153967A1

    公开(公告)日:2024-05-09

    申请号:US18503735

    申请日:2023-11-07

    CPC classification number: H01L27/124 H01L25/167 H01L27/1218

    Abstract: A display device includes a substrate having a first surface on which a light emitting element is located, a second surface on which a driving unit for driving the light emitting element is located, the second surface being opposite the first surface, and a first side surface between the first surface and the second surface, a first pad on the first surface of the substrate and electrically connected to the light emitting element, a second pad on the second surface of the substrate and electrically connected to the driving unit, and a side wiring on the first surface, the second surface, and the first side surface of the substrate to electrically connect the first pad and the second pad. The side wiring includes a first side wiring and a second side wiring spaced from each other.

    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20230413632A1

    公开(公告)日:2023-12-21

    申请号:US18118886

    申请日:2023-03-08

    CPC classification number: H10K59/1315 H10K59/1201

    Abstract: A display device includes a first conducive layer including a first and second wiring, a semiconductor layer on the first conductive layer and including a first to third semiconductor part, a gate insulating layer on the semiconductor layer, and a second conductive layer on the gate insulating layer and including a gate electrode overlapping the first semiconductor part, a first connecting electrode overlapping the second semiconductor part, and a second connecting electrode overlapping the third semiconductor part. The first and second connecting electrodes are directly connected to the second and third semiconductor parts, respectively. The second and third semiconductor parts include semiconductor openings. The first connecting electrode includes a (1-1)-th and (1-2)-th connecting electrodes. A width of the (1-2)-th connecting electrodes is less than a width of the (1-1)-th connecting electrode, and the (1-2)-th connecting electrodes protrude from the (1-1)-th connecting electrode toward the semiconductor openings.

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