公开(公告)号：US20250048912A1

公开(公告)日：2025-02-06

申请号：US18678171

申请日：2024-05-30

Applicant: Samsung Display Co., LTD.

Inventor： JONGIK LEE

IPC: H10K71/00 ,  H10K59/12

Abstract: A cover glass bonding method includes: aligning each wafer of a set of organic light-emitting diode on silicon (OLEDoS) wafers and disposing the set of OLEDoS wafers on an upper table vacuum assembly system (VAS) module of a VAS device without using a carrier glass; disposing an epoxy-drawn cover glass on a lower table VAS module of the VAS device; bonding the set of OLEDoS wafers and the epoxy-drawn cover glass, wherein a working position of each wafer of the set of OLEDoS wafers is individually controlled in the upper table VAS module of the VAS device.