公开(公告)号：US11825600B2

公开(公告)日：2023-11-21

申请号：US17410436

申请日：2021-08-24

Applicant: Samsung Display Co., LTD.

Inventor： Tae Jin Park ,  Gyung Hyun Ko ,  Hee Ju Ma ,  Woo Jin Lee ,  Yeon Je Cho

IPC: H05K3/28 ,  H05K1/02

CPC classification number: H05K1/0296 ,  H05K3/28 ,  H05K2201/10128

Abstract: Provided are a printed circuit board, a display device and a method of manufacturing a display device. The printed circuit board includes a base film including a first surface and a second surface, lead lines disposed on the first surface of the base film, and a first cover layer that covers at least a part of the lead lines and includes fill-in portions disposed between the lead lines. Each of the fill-in portions has a surface height less than a surface height of each of the lead lines with respect to the first surface of the base film.