公开(公告)号：US20140332776A1

公开(公告)日：2014-11-13

申请号：US14222275

申请日：2014-03-21

Applicant: Samsung Display Co., Ltd.

Inventor： Su Yeon YUN ,  Dong Jin SON

IPC: H01L27/32 ,  H01L27/12

CPC classification number: H01L27/3244 ,  H01L27/124 ,  H01L27/3248 ,  H01L27/3276 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/458 ,  H01L29/4908 ,  H01L51/0021 ,  H01L2227/323

Abstract: A manufacturing method of a wire including: forming a lower layer on a substrate; forming a middle layer on the lower layer; forming an upper layer on the middle layer; forming, exposing, and developing a photoresist layer on the upper layer to form a photoresist pattern; and etching the upper layer, the middle layer, and the lower layer by using the photoresist pattern as a mask to form a wire such that the upper layer covers an end of the middle layer.

Abstract translation: 一种线的制造方法，包括：在基板上形成下层; 在下层形成中间层; 在中间层上形成上层; 在上层形成，曝光和显影光致抗蚀剂层以形成光致抗蚀剂图案; 并且通过使用光致抗蚀剂图案作为掩模来蚀刻上层，中间层和下层，以形成上层覆盖中间层的端部。