公开(公告)号：US11203175B2

公开(公告)日：2021-12-21

申请号：US16502259

申请日：2019-07-03

Applicant: Samsung Display Co., Ltd.

Inventor： Sukju Kang ,  Byung-moo Kim ,  Geunyoung Yu

IPC: B32B3/00 ,  B32B27/00 ,  B29C65/00 ,  B32B3/04 ,  B29C65/70 ,  B29C65/48 ,  B32B27/08 ,  H05K5/00

Abstract: A bonding device includes an upper chamber a pad with which a display substrate is pressable to a substrate; a stage between a lower chamber and the pad and including an opening through which air is introduced; a molding member between an upper chamber and the pad and surrounding the pad and the opening; and a support member connected to the stage The display substrate disposed on the molding member disposes first and second portions of the display substrate overlapping the planar and bending portions of the substrate, respectively, the molding member presses the first portion to the planar portion, and air introduced through the opening, expands the molding member to press the second portion to the bending portion.