公开(公告)号：US20240081113A1

公开(公告)日：2024-03-07

申请号：US18330494

申请日：2023-06-07

Applicant: Samsung Display Co., Ltd.

Inventor： DONGUK KIM ,  CHAUNGI CHOI ,  HYUNHO KIM ,  HYOENG-KI KIM ,  HYEONBUM LEE ,  HOONGI LEE

IPC: H10K59/131 ,  H10K59/12 ,  H10K59/124 ,  H10K59/88

CPC classification number: H10K59/131 ,  H10K59/1201 ,  H10K59/124 ,  H10K59/88

Abstract: A display panel including a plurality of insulating layers, a light emitting element disposed above the plurality of insulating layers, a first transistor including an oxide semiconductor pattern, and a first gate disposed above the oxide semiconductor pattern, and a first dummy conductive pattern spaced apart from the first transistor. A first dummy hole is defined spaced apart from the first transistor in a direction perpendicular to a thickness direction and penetrating first contact insulating layers in contact with at least the first transistor among the plurality of insulating layers. The first dummy conductive pattern is disposed in the first dummy hole.

公开(公告)号：US20230136067A1

公开(公告)日：2023-05-04

申请号：US17976497

申请日：2022-10-28

Applicant: Samsung Display Co., LTD.

Inventor： CHAUNGI CHOI ,  HYOENG-KI KIM ,  HOONGI LEE

IPC: H01L27/32 ,  H01L51/56

Abstract: A display device includes: a display panel having a first non-folding portion, a first folding portion, a second non-folding portion, a second folding portion, and a third non-folding portion arranged along a first direction, wherein each of the first to third non-folding portions has a display area, a bending area extending along a second direction crossing the first direction, and a pad area connected to the display area with the bending area interposed therebetween; a first data driving chip on a first pad area of the first non-folding portion; a second data driving chip on a second pad area of the second non-folding portion; a third data driving chip on a third pad area of the third non-folding portion; and a circuit board attached on any one of the first to third pad areas and electrically connected to the first to third data driving chips.