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公开(公告)号:US20170170242A1
公开(公告)日:2017-06-15
申请号:US15219144
申请日:2016-07-25
Applicant: Samsung Display Co., Ltd.
Inventor: Su Hyuk CHOI , Jin Woo PARK , Ho Youn KIM , Hyun Chul OH , Ung Soo LEE , Jun Young LEE , Hyun Soo JUNG
CPC classification number: H01L27/323 , H01L27/3276 , H01L51/0097 , H01L51/5203 , H01L51/5246 , H01L51/5256 , H01L51/56
Abstract: A display device includes a first substrate including a first area and a second area, light emitting elements arranged in the first area, connecting pads arranged in the second area, a thin film encapsulation layer arranged on the light emitting elements, a second substrate including a third area and a fourth area, sensing pads arranged in the fourth area, a touch sensor layer including sensing electrodes arranged in the third area and sensing lines connected between the sensing electrodes and the sensing pads, an interlayer arranged between the thin film encapsulation layer and the touch sensor layer, and a conductive member connected between the connecting pads and the sensing pads.
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公开(公告)号:US20180233542A1
公开(公告)日:2018-08-16
申请号:US15948088
申请日:2018-04-09
Applicant: Samsung Display Co., Ltd.
Inventor: Su Hyuk CHOI , Jin Woo PARK , Ho Youn KIM , Hyun Chul OH , Ung Soo LEE , Jun Young LEE , Hyun Soo JUNG
CPC classification number: H01L27/323 , H01L27/3276 , H01L51/0097 , H01L51/5203 , H01L51/5246 , H01L51/5256 , H01L51/56 , Y02E10/549
Abstract: A display device includes a first substrate including a first area and a second area, light emitting elements arranged in the first area, connecting pads arranged in the second area, a thin film encapsulation layer arranged on the light emitting elements, a second substrate including a third area and a fourth area, sensing pads arranged in the fourth area, a touch sensor layer including sensing electrodes arranged in the third area and sensing lines connected between the sensing electrodes and the sensing pads, an interlayer arranged between the thin film encapsulation layer and the touch sensor layer, and a conductive member connected between the connecting pads and the sensing pads.
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