公开(公告)号：US20190389027A1

公开(公告)日：2019-12-26

申请号：US16411141

申请日：2019-05-14

申请人： Samsung Display Co., Ltd.

发明人： Seungbae KANG ,  Joon-hwa BAE ,  Heesung YANG ,  Woojin CHO ,  Kyongkwon CHOO

IPC分类号： B24B29/02 ,  B24B41/047

摘要： A substrate polishing apparatus including a stage configured to load a substrate, the stage having a flat surface, which is parallel to a first direction and a second direction, and on which the substrate is loaded, a pressing unit configured to exert a pressure on the substrate in a third direction, a rotary unit configured to revolve the pressing unit around a central axis parallel to the third direction, when viewed in a plan view, a plurality of polishing pads provided between the pressing unit and the substrate to be in contact with the substrate, and a nozzle part configured to supply a slurry onto the substrate. The polishing pads may be spaced apart from each other in a direction and may have a rectangular shape in the plan view.