公开(公告)号：US11023010B2

公开(公告)日：2021-06-01

申请号：US16935025

申请日：2020-07-21

Applicant: Samsung Display Co., Ltd.

Inventor： Nam Hee Park ,  Eun Gil Choi ,  Dae Kyun Oh ,  Young Joo Lee

IPC: G06F1/16 ,  H01L51/52 ,  B29D11/00 ,  G06F3/041 ,  G02F1/1333 ,  G06F3/044 ,  H04M1/02 ,  H01L51/00

Abstract: A panel bottom sheet and a display device including the same are provided. The panel bottom sheet includes a first base, a first light-absorbing layer disposed on a top surface or a bottom surface of the first base, a top bonding layer disposed above the first base and the first light-absorbing layer, an interlayer bonding layer disposed below the first base and the first light-absorbing layer, and a wiring pattern portion disposed below the interlayer bonding layer and including a plurality of wiring patterns.

公开(公告)号：US11422648B2

公开(公告)日：2022-08-23

申请号：US17155692

申请日：2021-01-22

Applicant: Samsung Display Co., LTD.

Inventor： Sung Ki Jung ,  Nam Hee Park

IPC: G06F3/041 ,  G06F3/0354 ,  H01L51/00 ,  H01L27/32

Abstract: A display device includes a bendable area and non-bendable areas adjacent to the bendable area; a display substrate including transistors and a light emitting element; a sensing layer disposed under the display substrate and including a digitizer; and an adhesive layer disposed between the display substrate and the sensing layer, wherein the adhesive layer includes a first surface facing the sensing layer; and groove patterns recessed from the first surface of the adhesive layer.

公开(公告)号：US10756307B2

公开(公告)日：2020-08-25

申请号：US15858086

申请日：2017-12-29

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Nam Hee Park ,  Eun Gil Choi ,  Dae Kyun Oh ,  Young Joo Lee

IPC: H01L51/52 ,  G06F1/16 ,  H01L51/00 ,  B29D11/00 ,  G06F3/044 ,  G06F3/041 ,  H04M1/02 ,  G02F1/1333

Abstract: A panel bottom sheet and a display device including the same are provided. The panel bottom sheet includes a first base, a first light-absorbing layer disposed on a top surface or a bottom surface of the first base, a top bonding layer disposed above the first base and the first light-absorbing layer, an interlayer bonding layer disposed below the first base and the first light-absorbing layer, and a wiring pattern portion disposed below the interlayer bonding layer and including a plurality of wiring patterns.