公开(公告)号：US20250166550A1

公开(公告)日：2025-05-22

申请号：US18908793

申请日：2024-10-08

Applicant: Samsung Display Co., Ltd.

Inventor： Jong Sik SHIM ,  Sang Myoung LEE ,  Dae Seop KIM ,  Tae Hoon KIM ,  Seung Hwan CHEONG ,  Seung Ji CHA

IPC: G09G3/20 ,  G09G3/32 ,  G09G3/3233

Abstract: A display device includes a display panel including a sub-pixel, and a display panel driver for driving the display panel. The sub-pixel includes a driving transistor, a storage capacitor connected to a control electrode of the driving transistor, a write transistor writing a data voltage to the storage capacitor in response to a write gate signal, a first emission transistor providing a first power voltage to a first electrode of the driving transistor in response to a first emission signal, a hold capacitor including a first electrode receiving the first power voltage and a second electrode connected to a second electrode of the driving transistor, and a light emitting element emitting light. The first emission signal has an active level in a first portion of each of first periods of one frame, and has the active level in each of second periods respectively subsequent to the first periods.

公开(公告)号：US20210066828A1

公开(公告)日：2021-03-04

申请号：US16837919

申请日：2020-04-01

Applicant: Samsung Display Co., Ltd.

Inventor： Chan Yoon WOO ,  Seung Hwan CHEONG ,  Ah Young SON

IPC: H01R12/62 ,  H05K1/14

Abstract: The display device includes: a display panel; a first circuit board having a first portion connected to one portion of the display panel and comprising a connector; and a second circuit board electrically connected to the first circuit board through the connector, wherein the first portion includes a base film, a dummy pad disposed on the base film, and a first solder mask partially covering the dummy pad and exposing a portion of the dummy pad, the dummy pad includes a covered region covered by the first solder mask and an exposed region exposed by the first solder mask, and a solder ball, The exposed region of the dummy pad is connected to the connector through a solder ball.

公开(公告)号：US20210037647A1

公开(公告)日：2021-02-04

申请号：US16831122

申请日：2020-03-26

Applicant: Samsung Display Co., Ltd.

Inventor： Seung Hwan CHEONG ,  Ah Young SON ,  Chan Yoon WOO

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H05K1/14

Abstract: A display device includes: a display panel; and a first substrate connected to the display panel, wherein the first substrate comprises: a first base substrate; a first wiring layer having a plurality of first signal wirings on the first base substrate; and a first ground wiring layer on the first wiring layer, wherein the first ground wiring layer comprises a mesh pattern area and a non-mesh pattern area, wherein the mesh pattern area comprises a plurality of first mesh patterns and openings surrounded by adjacent first mesh patterns, and the non-mesh pattern area comprises a plurality of second mesh patterns and non-mesh patterns surrounded by adjacent second mesh patterns, wherein the non-mesh patterns are physically connected to the adjacent second mesh patterns.

公开(公告)号：US20220295653A1

公开(公告)日：2022-09-15

申请号：US17389564

申请日：2021-07-30

Applicant: Samsung Display Co., LTD.

Inventor： Kyu Min HAN ,  Seung Hwan CHEONG

IPC: H05K5/02 ,  H05K5/00

Abstract: A connection member includes a first region, a second region, and a third region, where a number of conductive layers in the second region is greater than a number of conductive layers in the first region and is greater than a number of conductive layers in the third region, a first layer, which is an uppermost layer of the second region, extends to the third region, a second layer, which is a lowermost layer of the third region, extends to the second region, and a side portion of the second region at a boundary between the second region and the third region is covered by the first layer and the second layer.

公开(公告)号：US20210288128A1

公开(公告)日：2021-09-16

申请号：US17198947

申请日：2021-03-11

Applicant: Samsung Display Co., Ltd.

Inventor： Seung Hwan CHEONG ,  Sung Bae PARK ,  Myung Joon YOON ,  Kyu Min HAN

IPC: H01L27/32 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552

Abstract: An electronic device package includes: a substrate including a central region, and a first side region and a second side region at opposite sides of the central region; a first component in the first side region or the second side region, the first component having a first height above a surface of the substrate; a second component in the central region, the second component having a second height above the surface of the substrate that is lower than the first height; a reinforcement member in the central region and overlapping the second component, the reinforcement member having a third height above the surface of the substrate that is lower than the first height and higher than the second height; and an encapsulation member covering the first component and the second component.

公开(公告)号：US20250133657A1

公开(公告)日：2025-04-24

申请号：US19007935

申请日：2025-01-02

Applicant: Samsung Display Co., LTD.

Inventor： Kyu Min HAN ,  Seung Hwan CHEONG

IPC: H05K1/11 ,  H05K1/02

Abstract: A connection member includes a first region, a second region, and a third region, where a number of conductive layers in the second region is greater than a number of conductive layers in the first region and is greater than a number of conductive layers in the third region, a first layer, which is an uppermost layer of the second region, extends to the third region, a second layer, which is a lowermost layer of the third region, extends to the second region, and a side portion of the second region at a boundary between the second region and the third region is covered by the first layer and the second layer.

公开(公告)号：US20230363091A1

公开(公告)日：2023-11-09

申请号：US18223245

申请日：2023-07-18

Applicant: Samsung Display Co., LTD.

Inventor： Kyu Min HAN ,  Seung Hwan CHEONG

IPC: H05K1/11

CPC classification number: H05K1/118 ,  H05K2201/10128 ,  H05K1/0218

Abstract: A connection member includes a first region, a second region, and a third region, where a number of conductive layers in the second region is greater than a number of conductive layers in the first region and is greater than a number of conductive layers in the third region, a first layer, which is an uppermost layer of the second region, extends to the third region, a second layer, which is a lowermost layer of the third region, extends to the second region, and a side portion of the second region at a boundary between the second region and the third region is covered by the first layer and the second layer.