公开(公告)号：US11600687B2

公开(公告)日：2023-03-07

申请号：US17198947

申请日：2021-03-11

申请人： Samsung Display Co., Ltd.

发明人： Seung Hwan Cheong ,  Sung Bae Park ,  Myung Joon Yoon ,  Kyu Min Han

IPC分类号： H01L23/552 ,  H01L27/32 ,  H01L23/31 ,  H01L23/498 ,  G06F3/147

摘要： An electronic device package includes: a substrate including a central region, and a first side region and a second side region at opposite sides of the central region; a first component in the first side region or the second side region, the first component having a first height above a surface of the substrate; a second component in the central region, the second component having a second height above the surface of the substrate that is lower than the first height; a reinforcement member in the central region and overlapping the second component, the reinforcement member having a third height above the surface of the substrate that is lower than the first height and higher than the second height; and an encapsulation member covering the first component and the second component.