ARRAY SUBSTRATE
    1.
    发明申请
    ARRAY SUBSTRATE 有权
    阵列基板

    公开(公告)号:US20170047356A1

    公开(公告)日:2017-02-16

    申请号:US15075345

    申请日:2016-03-21

    CPC classification number: H01L27/1244 G02F1/13452 G02F1/136259 H01L27/124

    Abstract: An array substrate includes a plurality of signal lines disposed in a display area; a plurality of signal pads disposed in a non-display area; and a fan-out portion disposed in the non-display. The fan-out portion includes a plurality of fan-out lines connecting the plurality of signal lines to the plurality of signal pads. Each of the plurality of fan-out lines includes a pattern electrically connected to a corresponding signal pad of the plurality of signal pads, and a straight portion electrically connected to a corresponding signal line of the plurality of signal lines. The pattern includes a first conductive layer. The straight portion includes the first conductive layer and a second conductive layer disposed on the first conductive layer.

    Abstract translation: 阵列基板包括布置在显示区域中的多条信号线; 设置在非显示区域中的多个信号焊盘; 以及设置在非显示器中的扇出部分。 扇出部分包括将多个信号线连接到多个信号焊盘的多个扇出线。 多个扇出线中的每一个包括电连接到多个信号焊盘的相应信号焊盘的图案,以及电连接到多条信号线的相应信号线的直线部分。 该图案包括第一导电层。 直的部分包括第一导电层和设置在第一导电层上的第二导电层。

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