公开(公告)号：US11874569B2

公开(公告)日：2024-01-16

申请号：US17743101

申请日：2022-05-12

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han Ho Park ,  Dae Geun Lee ,  Su Jeong Kim ,  Sang Won Yeo ,  Kyung Mok Lee ,  Wu Hyen Jung

IPC: G02F1/1345 ,  G09F9/35 ,  H01L23/00 ,  H05K1/11 ,  H05K3/32 ,  G02F1/1333

CPC classification number: G02F1/13452 ,  G02F1/13458 ,  G09F9/35 ,  H01L24/06 ,  H05K1/117 ,  H05K1/118 ,  H05K3/321 ,  G02F1/13454 ,  G02F1/133305 ,  H01L2224/50 ,  H01L2224/79 ,  H01L2224/86 ,  H01L2225/06579 ,  H05K2201/09427 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

公开(公告)号：US12298633B2

公开(公告)日：2025-05-13

申请号：US18537672

申请日：2023-12-12

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han Ho Park ,  Dae Geun Lee ,  Su Jeong Kim ,  Sang Won Yeo ,  Kyung Mok Lee ,  Wu Hyen Jung

IPC: G02F1/1345 ,  G02F1/1333 ,  G09F9/35 ,  H01L23/00 ,  H05K1/11 ,  H05K3/32

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

公开(公告)号：US10782573B2

公开(公告)日：2020-09-22

申请号：US16422708

申请日：2019-05-24

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han Ho Park ,  Dae Geun Lee ,  Su Jeong Kim ,  Sang Won Yeo ,  Kyung Mok Lee ,  Wu Hyen Jung

IPC: G02F1/1345 ,  G09F9/35 ,  H01L23/00 ,  H05K1/11 ,  H05K3/32 ,  G02F1/1333

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

公开(公告)号：US11347120B2

公开(公告)日：2022-05-31

申请号：US17025857

申请日：2020-09-18

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Han Ho Park ,  Dae Geun Lee ,  Su Jeong Kim ,  Sang Won Yeo ,  Kyung Mok Lee ,  Wu Hyen Jung

IPC: G02F1/1345 ,  G09F9/35 ,  H01L23/00 ,  H05K1/11 ,  H05K3/32 ,  G02F1/1333

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

公开(公告)号：US10303017B2

公开(公告)日：2019-05-28

申请号：US15807455

申请日：2017-11-08

Applicant: Samsung Display Co., Ltd.

Inventor： Han Ho Park ,  Dae Geun Lee ,  Su Jeong Kim ,  Sang Won Yeo ,  Kyung Mok Lee ,  Wu Hyen Jung

IPC: G09F9/35 ,  H05K1/11 ,  H05K3/32 ,  H01L23/00 ,  G02F1/1333 ,  G02F1/1345

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.