公开(公告)号：US20210161016A1

公开(公告)日：2021-05-27

申请号：US16918946

申请日：2020-07-01

Applicant: Samsung Display Co., Ltd.

Inventor： John PARK ,  Seung-Woo KANG ,  Soon-Sung PARK ,  Jun Ho PARK ,  Yong Uk SONG ,  Su Chang RYU ,  Jung Soo YOUN

IPC: H05K1/18 ,  H05K1/11 ,  G06F3/041 ,  H05K3/32

Abstract: A flexible printed circuit board including: a base film; an electrode pad disposed on one side of the base film; a circuit pattern connected with the electrode pad; a coverlay that overlaps at least a part of the circuit pattern; and a cover resin that overlaps the circuit pattern and at least a part of the coverlay. The coverlay includes a body portion and a protrusion protruded from the body portion.