公开(公告)号：US10404091B2

公开(公告)日：2019-09-03

申请号：US15292397

申请日：2016-10-13

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ki Won Chang ,  Hyung Wook Cho ,  Dong Woo Han ,  Si Hyung Kim ,  Tae Seok Yang ,  Choon Hee Kim ,  Chang Mok Han ,  Taek Woo Kim

IPC: H02J7/02 ,  H02J50/80 ,  H04B5/00 ,  H02J7/00 ,  H02J50/10

Abstract: A coil substrate for wireless power transmission includes: an insulating substrate including a first surface and a second surface; a first wiring portion disposed on the first surface, wherein the first wiring portion includes first spiral patterns and a section in which opposing ends of each of the first spiral patterns are disposed parallel to each other; a second wiring portion disposed on the second surface and including second spiral patterns, wherein opposing ends of each of the second spiral patterns are spaced apart from each other; and conductive vias alternately connecting the first spiral patterns and the second spiral patterns to each other to form coil turns.