公开(公告)号：US20210029825A1

公开(公告)日：2021-01-28

申请号：US17070289

申请日：2020-10-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Young-Kuk KO ,  Yoong OH ,  Sang-Hoon KIM ,  Gyu-Mook KIM ,  Yong-Soon JANG ,  Hea-Sung KIM

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/06

Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.

公开(公告)号：US20200152566A1

公开(公告)日：2020-05-14

申请号：US16658288

申请日：2019-10-21

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yoong OH ,  Sang-Hoon KIM ,  Hea-Sung KIM ,  Gyu-Mook KIM ,  Young-Kuk KO

IPC: H01L23/498 ,  H01L25/00 ,  H01L21/48

Abstract: A printed circuit board including: an insulating material having a bump pad embedded in a first surface thereof; a first insulating layer stacked on the first surface of the insulating material and including an opening portion exposing the bump pad; a second insulating layer stacked on the first insulating layer and including a first cavity exposing the opening portion; and a bump disposed on the bump pad in the opening portion.

公开(公告)号：US20200260580A1

公开(公告)日：2020-08-13

申请号：US16662529

申请日：2019-10-24

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Young-Kuk KO ,  Yoong OH ,  Sang-Hoon KIM ,  Gyu-Mook KIM ,  Hea-Sung KIM

IPC: H05K1/11 ,  H05K1/18

Abstract: A printed circuit board includes: an insulating layer; a via passing through the insulating layer; and a metal post in contact with a surface of the via, and protruding from the insulating layer. The metal post includes a region having a width that is greater than a width of the via.