公开(公告)号：US20190304926A1

公开(公告)日：2019-10-03

申请号：US16181404

申请日：2018-11-06

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jong In RYU ,  Suk Youn HONG ,  Gi Su CHI ,  Seung Hyun HONG ,  Ki Chan KIM

IPC: H01L23/552 ,  H01L23/538 ,  H01L23/31 ,  H01L23/66 ,  H01L25/00 ,  H01L21/56 ,  H01L25/16

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.

公开(公告)号：US20200098699A1

公开(公告)日：2020-03-26

申请号：US16695597

申请日：2019-11-26

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jong In RYU ,  Suk Youn HONG ,  Gi Su CHI ,  Seung Hyun HONG ,  Ki Chan KIM

IPC: H01L23/552 ,  H01L23/66 ,  H01L25/16 ,  H01L21/56 ,  H01L25/00 ,  H01L23/538 ,  H01L23/31

Abstract: An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.