公开(公告)号：US11048307B2

公开(公告)日：2021-06-29

申请号：US16364349

申请日：2019-03-26

申请人： Samsung Electro-Mechanics Co., Ltd.

发明人： Won Ki Park ,  Jong Woo Kim ,  Jong Yong Park ,  Seok Jo Hwang ,  Ick Chan Shim ,  Dae Hyun Jeong ,  Byung Gi An ,  Dae Wook Kim ,  Kyung Hoon Choi

IPC分类号： G06F1/16 ,  H05K1/02 ,  H04N5/225

摘要： A dual camera module includes a single housing accommodating a plurality of lens modules, a first actuator configured to move one of the plurality of lens modules in an optical axis direction, and a plurality of printed circuit boards attached to a lower portion of the single housing. One printed circuit board corresponding to a lens module moved by the first actuator, among the plurality of printed circuit boards, is disposed to be lower than the other printed circuit boards in the optical axis direction.