公开(公告)号：US11297714B2

公开(公告)日：2022-04-05

申请号：US17070289

申请日：2020-10-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Young-Kuk Ko ,  Yoong Oh ,  Sang-Hoon Kim ,  Gyu-Mook Kim ,  Yong-Soon Jang ,  Hea-Sung Kim

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/06

Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.