公开(公告)号：US20230070184A1

公开(公告)日：2023-03-09

申请号：US17893604

申请日：2022-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Beomsik KIM ,  Jaehyoung PARK ,  Jaemyung LEE

IPC: H04N5/232 ,  H04N5/247

Abstract: An electronic device is provided and includes a display, a camera configured to acquire an image using light introduced through the display, and at least one processor configured to be electrically connected to the display and the camera, wherein the at least one processor is configured to acquire the image through the camera, acquire a first adjustment value corresponding to the display and for correcting the image, acquire a second adjustment value corresponding to the camera and for correcting the image, and correct the image based on the first adjustment value and the second adjustment value.

公开(公告)号：US20240348907A1

公开(公告)日：2024-10-17

申请号：US18752312

申请日：2024-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyosang AN ,  Hwajoong JUNG ,  Beomsik KIM ,  Bongchan KIM ,  Taehwan KIM ,  Hyungjin RHO ,  Jaeheung PARK ,  Kwangseok BYON ,  Jonghoon WON

IPC: H04N23/55 ,  H04N23/54

CPC classification number: H04N23/55 ,  H04N23/54

Abstract: A camera module according to various embodiments of the disclosure may include: an image sensor (140); a substrate (110) electrically connected to the image sensor (140); a bracket (120) configured to fix the substrate (110); and a plate (130) disposed on the bracket (120) such that the width (131) of a surface of the plate (130) facing the image sensor (140) includes the width (141) of an area in which the image sensor (140) is disposed, thereby shielding at least a part of a space in which the image sensor (140) is disposed from the outside, wherein the bracket (120) may be formed by injection molding a material forming the bracket (120) in a state in which the plate (130) is inserted into a mold. Various other embodiments inferable from the specification are also possible