公开(公告)号：US12200154B2

公开(公告)日：2025-01-14

申请号：US17738550

申请日：2022-05-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunggun Cho ,  Bokgyu Song ,  Wonhee Choi

IPC: H05K1/00 ,  H04M1/02 ,  H05K1/02 ,  H05K1/18

Abstract: An electronic device is provided. The electronic device includes a first housing including a first through hole, a flexible printed circuit board including a plurality of layers, a first portion of the flexible printed circuit board disposed to pass through the through hole, a bonding member being disposed between the plurality of layers constituting the first portion, and a waterproofing member formed to surround at least part of the first portion of the flexible printed circuit board.