公开(公告)号：US20250083279A1

公开(公告)日：2025-03-13

申请号：US18661972

申请日：2024-05-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongwon Ahn ,  Eunsil Bae

IPC: B24B49/04 ,  B24B49/14

Abstract: A polishing process apparatus includes a carrier including a polishing head on which a polishing object is provided, a polishing pad on a lower portion of the carrier, a plurality of temperature sensors on the carrier, and a controller configured to control the carrier, the polishing pad, and the plurality of temperature sensors. The plurality of temperature sensors are in a row in a radial direction, parallel to an upper surface of the polishing head and extending outwardly from a rotation axis of the polishing head. The controller is configured to derive an end point in time of a polishing process using the plurality of temperature sensors and to precisely manage a thickness of the polishing object to be polished, thereby improving reliability of the polishing process apparatus.