公开(公告)号：US20170358847A1

公开(公告)日：2017-12-14

申请号：US15621687

申请日：2017-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-Min CHO ,  Chan-Gi Park ,  Yeon-Sang Yun ,  Tae-Wook Ham ,  Hei-Seong Kwak ,  Byoung-II Son ,  Sung-Chul Park

IPC: H01Q1/24 ,  H05K1/02 ,  H05K1/14 ,  H05K7/14 ,  H01R12/79 ,  H05K1/18 ,  H05K1/11 ,  H01R13/66 ,  H01Q1/38

Abstract: An electronic device including a housing; a printed circuit board (PCB) in the housing, wherein the PCB includes a plurality of layers with one or more conductive and insulation layers; a first electrical component formed as at least a part of or in the housing; a second electrical component above or near the PCB in the housing, wherein the first and second electrical components are separated; and at least one electrical path extending from the first electrical component to the second electrical component, wherein at least a portion of the electrical path runs on or inside the PCB, wherein the PCB includes a region including a pattern of conductive vias, wherein each of the vias extends through at least part of the plurality of layers to contact at least one of the one or more conductive layers, and wherein the electrical path runs through the region without contacting the vias.