公开(公告)号：US12135590B2

公开(公告)日：2024-11-05

申请号：US17521186

申请日：2021-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byungseon Hwang ,  Deokhee Lee ,  Sunggyu Lee

IPC: G06F1/16 ,  G06V40/13

Abstract: An electronic device is provided. The electronic device includes a housing and a sensor module disposed in at least a portion of the housing. The sensor module includes a fingerprint recognition sensor, a protective layer covering the fingerprint recognition sensor, an adhesive member placed on the protective layer, and a ceramic layer placed on the adhesive member, wherein the edge of the ceramic layer, the edge of the adhesive member, and the edge of a part of the protective layer include machined surfaces. Other embodiments are also possible.

公开(公告)号：US10817701B2

公开(公告)日：2020-10-27

申请号：US16282657

申请日：2019-02-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byungseon Hwang ,  Deokhee Lee ,  Sunggyu Lee

IPC: G06K9/00 ,  B32B27/16 ,  G06F1/16 ,  H01L23/29 ,  H01L23/00 ,  H04M1/02

Abstract: An electronic device is provided. The electronic device includes a fingerprint sensor including a sensor having a surface including epoxy molding compound (EMC) resin, a first layer disposed on the surface of the sensor or above the surface of the sensor, and a second layer disposed on the first layer or above the first layer. The first layer includes a first ultraviolet (UV) hardening material having first hardness. The second layer includes a second UV hardening material having second hardness greater than the first hardness and a surface of the second layer has surface roughness less than a specified value.