公开(公告)号：US20190261515A1

公开(公告)日：2019-08-22

申请号：US16281702

申请日：2019-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wangik SON ,  Minho KIM ,  Sunghyun KIM ,  Eungwon KIM ,  Chanbeom JEONG

IPC: H05K1/14 ,  H05K1/02 ,  H01R12/51 ,  H01R4/04

Abstract: An electronic device is provided. The electronic device includes a conductive support member, a first circuit board connected to the conductive support member by a first capacitor, a second circuit board connected to the conductive support member by a second capacitor, a first conductive connection member electrically connecting the first circuit board and the second circuit board, and a first ground structure, at least a portion of the first ground structure being interposed between the first conductive connection member and the conductive support member. The ground structure includes a non-conductive layer physically contacting the conductive support member, and a conductive layer electrically connected to the first conductive connection member to form a capacitive coupling with the conductive support member.