公开(公告)号：US12234400B2

公开(公告)日：2025-02-25

申请号：US18098847

申请日：2023-01-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjun Park ,  Jaesung Lee ,  Junghun Lim ,  Jungmin Oh ,  Sangwon Bae ,  Hyosan Lee

IPC: C09K13/10 ,  C09K13/08 ,  H01L21/306 ,  H10B12/00

Abstract: An etchant composition for etching a silicon germanium film includes, based on a total weight of the etchant composition, about 5 wt % to about 14 wt % of an oxidant, about 0.01 wt % to about 5 wt % of a fluorine compound, about 0.01 wt % to about 5 wt % of an amine compound, about 0.01 wt % to about 1 wt % of an alcohol compound having a hydrophilic head and a hydrophobic tail, about 60 wt % to about 90 wt % of an organic solvent, and a balance of water. A method of manufacturing an integrated circuit device includes: forming, on a substrate, a structure in which a plurality of silicon films and a plurality of silicon germanium films are alternately stacked; and selectively removing the plurality of silicon germanium films by using the etchant composition.

公开(公告)号：US11741886B2

公开(公告)日：2023-08-29

申请号：US17712687

申请日：2022-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghyun Song ,  Sangtae Han ,  Huigyeong Ahn ,  Changsun Kang ,  Mijin Kim ,  Seongjun Kim ,  Changjun Park ,  Seunghee Oh ,  Kyoree Lee ,  Mihyun Lee

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G2300/0408 ,  G09G2300/0439 ,  G09G2310/0275

Abstract: A display apparatus is provided. The display apparatus includes a substrate having a data line disposed thereon, a plurality of pixel modules arranged in a matrix format on the substrate, and a driver providing a digital data signal through the data line to each of the pixel modules. Each of the pixel modules may include a light emitting layer in which a plurality of light emitting diode (LED) devices form a pixel, a driving layer comprising a display driver integrated circuit (DDI) below the light emitting layer and generating a driving signal to drive the LED devices, and a substrate layer, between the driving layer and the substrate, comprising a data input pad to receive the data signal and transmit the data signal to the DDI and a data output pad to provide the data signal to another adjacent pixel module.