ELECTRONIC DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE AND OPERATING METHOD OF ELECTRONIC DEVICE

    公开(公告)号:US20230028712A1

    公开(公告)日:2023-01-26

    申请号:US17701520

    申请日:2022-03-22

    Abstract: Disclosed is an operating method of an electronic device which includes receiving a design layout for manufacturing the semiconductor device, generating a first layout by performing machine learning-based process proximity correction (PPC), generating a second layout by performing optical proximity correction (OPC), and outputting the second layout for a semiconductor process. The generating of the first layout includes generating a first after cleaning inspection (ACI) layout by executing a machine learning-based process proximity correction module on the design layout, generating a second after cleaning inspection layout by adjusting the design layout based on a difference of the first after cleaning inspection layout and the design layout and executing the process proximity correction module on the adjusted layout, and outputting the adjusted layout as the first layout, when a difference between the second after cleaning inspection layout and the design layout is smaller than or equal to a threshold value.

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