公开(公告)号：US20230411422A1

公开(公告)日：2023-12-21

申请号：US18169954

申请日：2023-02-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hanseok KIM ,  Chanhyeon Seong ,  Eungkyu Lee ,  Jeong-Ho Lee

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14645

Abstract: An image sensor includes a substrate having opposite first and second surfaces and including first to third unit pixels arranged in a first direction, and first and second pixel separation portions in the substrate and between, and separating from each other, separate adjacent unit pixels of the first to third unit pixels. The first pixel separation portion includes a first conductive pattern, and a first separation insulating pattern covering a sidewall of the first conductive pattern. The second pixel separation portion includes a second conductive pattern, and a second separation insulating pattern covering a sidewall of the second conductive pattern. The first conductive pattern has a first width in the first direction, and the second conductive pattern has a second width in the first direction, which is less than the first width.