公开(公告)号：US11201396B2

公开(公告)日：2021-12-14

申请号：US16702948

申请日：2019-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungmin Park ,  Chih Wei Lee ,  Chonghwa Seo ,  Sungcheol Yoo ,  Jongwon Lee

IPC: H01Q1/52 ,  H01Q21/06 ,  H01Q21/00 ,  H01Q1/24

Abstract: An antenna module comprises a printed circuit board, a communication circuit disposed on a first surface of the printed circuit board, an array antenna configured to transmit/receive a signal in a specified high-frequency band with the communication circuit, wherein the array antenna includes, first conductive elements disposed on the first surface of the printed circuit board, and second conductive elements disposed on a second surface facing the first conductive elements, and a first molding layer covering the first conductive elements.

公开(公告)号：US11011828B2

公开(公告)日：2021-05-18

申请号：US16383812

申请日：2019-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungmin Park ,  Chih Wei Lee ,  Chonghwa Seo ,  Sungcheol Yoo ,  Jongwon Lee

IPC: H01Q1/24 ,  H01Q21/30 ,  H01Q21/06

Abstract: Disclosed is an electronic device. The electronic device comprises a housing forming an exterior of the electronic device, and including a front surface, a back surface facing away from the front surface, and a side surface substantially perpendicular to the front surface and the back surface; a first conductive plate positioned towards the back surface having a first antenna array disposed on the first conductive plate, the first antenna array configured to radiate a signal in a first frequency band toward the back surface; a second antenna array connected to the conductive plate, the second antenna array configured to radiate a signal in a second frequency band at least partially different from the first frequency band toward the side surface, and having an antenna element at least partially different from the first antenna array, a second conductive plate positioned towards the side surface having a third antenna array disposed on the second conductive plate, the third antenna array configured to radiate the signal in the second frequency band toward the side surface, and a fourth antenna array connected to the second conductive plate and configured to radiate the signal in the first frequency band toward the back surface.