公开(公告)号：US20130154136A1

公开(公告)日：2013-06-20

申请号：US13714469

申请日：2012-12-14

申请人： Samsung Electronics Co., Ltd.

发明人： Tae Jun KIM ,  Sang Bok YUN ,  Min Young SON ,  Choong Hwan KWON ,  Sung Ho PARK

IPC分类号： B29D11/00

CPC分类号： B29D11/0074 ,  B29D11/00605

摘要： A method of forming a plurality of reflectors for a light emitting device (LED) package includes receiving a first fluid material at at least a first source opening of an upper mold of a transfer apparatus; passing the first fluid material through a transfer passageway of the upper mold; expelling the first fluid material from the transfer passageway through a plurality of openings in a lower internal surface of a transfer chamber of the transfer passageway; depositing the first fluid material on a lead frame, disposed on a lower mold of the transfer apparatus, through the plurality of openings; forming the first fluid material into a plurality of molded structures using the upper mold and the lower mold; and hardening each of the molded structures to form a plurality of reflectors.

摘要翻译： 形成用于发光器件（LED）封装的多个反射器的方法包括：在传送设备的上模的至少第一源开口处接收第一流体材料; 使第一流体材料通过上模的传送通道; 通过所述传送通道的传送室的下内表面中的多个开口排出所述第一流体材料从所述传送通道; 通过所述多个开口将第一流体材料沉积在设置在所述传送装置的下模具上的引线框架上; 使用上模具和下模具将第一流体材料形成为多个模制结构; 并且硬化每个模制结构以形成多个反射器。