公开(公告)号：US11139253B2

公开(公告)日：2021-10-05

申请号：US16583335

申请日：2019-09-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chui Woo Kim ,  Sang Min Yong ,  Yang Gyoo Jung

IPC: H01L23/16 ,  H01L23/00 ,  H01L25/065

Abstract: A semiconductor package is provided. The semiconductor package comprises a first substrate, a second substrate disposed on the first substrate, a first semiconductor chip disposed on the second substrate, and a stiffener extending from an upper surface of the first substrate to an upper surface of the second substrate, the stiffener not being in contact with the first semiconductor chip, wherein a first height from the upper surface of the first substrate to an upper surface of the first semiconductor chip is greater than a second height from the upper surface of the first substrate to an uppermost surface of the stiffener.