公开(公告)号：US20220093527A1

公开(公告)日：2022-03-24

申请号：US17543920

申请日：2021-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-gu KANG ,  Young-mok KIM ,  Woon-bae KIM ,  Dae-cheol SEONG ,  Yune-seok CHUNG

IPC: H01L23/552 ,  H01L23/48 ,  H01L23/00 ,  H01L21/74

Abstract: An integrated circuit chip includes an SOI substrate having a structure in which a bulk substrate, a buried insulating film, and a semiconductor body layer are sequentially stacked, a conductive ion implantation region formed at a position adjacent to the buried insulating film in the bulk substrate, an integrated circuit portion formed on an active surface of the semiconductor body layer, and a penetrating electrode portion arranged at a position spaced apart from the integrated circuit portion in a horizontal direction, the penetrating electrode portion penetrating the semiconductor body layer and the buried insulating layer in a vertical direction, and the penetrating electrode portion connected to the conductive ion implantation region. An integrated circuit package and a display device include the integrated circuit chip.

公开(公告)号：US20200227359A1

公开(公告)日：2020-07-16

申请号：US16589589

申请日：2019-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-gu KANG ,  Young-mok KIM ,  Woon-bae KIM ,  Dae-cheol SEONG ,  Yune-seok CHUNG

IPC: H01L23/552 ,  H01L23/48 ,  H01L23/00 ,  H01L21/74

Abstract: An integrated circuit chip includes an SOI substrate having a structure in which a bulk substrate, a buried insulating film, and a semiconductor body layer are sequentially stacked, a conductive ion implantation region formed at a position adjacent to the buried insulating film in the bulk substrate, an integrated circuit portion formed on an active surface of the semiconductor body layer, and a penetrating electrode portion arranged at a position spaced apart from the integrated circuit portion in a horizontal direction, the penetrating electrode portion penetrating the semiconductor body layer and the buried insulating layer in a vertical direction, and the penetrating electrode portion connected to the conductive ion implantation region. An integrated circuit package and a display device include the integrated circuit chip.