公开(公告)号：US20230010252A1

公开(公告)日：2023-01-12

申请号：US17700825

申请日：2022-03-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Shigenobu Maeda ,  Wook Kim ,  Hongsik Kim ,  Heejun Kim ,  Seyoung Park ,  Seongjin Yoo ,  Minhong Yun ,  Daehan Han

IPC: G06F30/398 ,  G06F30/27

Abstract: Provided is a semiconductor process modeling system. The semiconductor process modeling system includes a preprocessing component configured to generate tensor data from raw data obtained from semiconductor manufacturing equipment, wherein, when the raw data is expressed as a raw matrix representing values of a plurality of process parameters for each of a plurality of wafers, at least one element of the raw matrix is omitted, when the tensor data is expressed as a tensor matrix representing values of a plurality of preprocessed process parameters for each of the plurality of wafers, the number of omitted elements of the tensor matrix is less than the number of omitted elements of the raw matrix, and the preprocessing component is configured to generate the tensor data by modifying the raw data based on at least one of characteristics of the semiconductor manufacturing equipment and characteristics of the plurality of process parameters.