公开(公告)号：US20230131531A1

公开(公告)日：2023-04-27

申请号：US17946461

申请日：2022-09-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunseok Kim ,  Dahye Lee ,  Wanho Park

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes: a package substrate, a first stack structure disposed on the package substrate, the first stack structure including first semiconductor chips stacked and connected to each other by bonding wires, a second stack structure disposed on the first stack structure, and including second semiconductor chips stacked, the second stack structure having an overhang region protruding beyond an uppermost first semiconductor chip of the first stack structure among the first semiconductor chips, an adhesive member covering a lower surface of the second stack structure and adhered to a portion of upper surfaces of the first stack structure, and an encapsulant disposed on the package substrate and covering the first stack structure and the second stack structure, wherein at least a portion of the bonding wires are buried in the die adhesive film in the overhang region to support the second stack structure.