公开(公告)号：US20180366358A1

公开(公告)日：2018-12-20

申请号：US15789082

申请日：2017-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Shin ,  Seung Jae Lee ,  Sang Geun Park ,  Dong Seok Baek

IPC: H01L21/68 ,  C23C16/52 ,  G01B11/14 ,  G01B11/27

Abstract: An apparatus for determining alignment of semiconductor processing equipment includes a sensing unit comprising a light emitting unit configured to irradiate a reflection substrate positioned opposite the apparatus and a light accepting unit configured to receive reflected light from the reflection substrate, a control unit configured to determine a gap between the sensing unit and the reflection substrate based on the received reflected light, and a wireless communication unit configured to transmit data regarding the determined gap to an electronic device. Methods of aligning semiconductor processing equipment and methods of fabricating semiconductor devices are also disclosed.