公开(公告)号：US20240429176A1

公开(公告)日：2024-12-26

申请号：US18417494

申请日：2024-01-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： JU-IL CHOI ,  KWANGOK JEONG ,  JAEMOK JUNG ,  JEONGGI JIN ,  TAE OH HA ,  HONGSEO HEO

IPC: H01L23/544 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

Abstract: A semiconductor package including: a first redistribution structure; a semiconductor chip on the first redistribution structure; a pad insulation layer on a lower surface of the first redistribution structure; a conductive pad extending into a lower surface of the pad insulation layer and electrically connected to the first redistribution structure; and a plurality of alignment patterns on an edge of the pad insulation layer, each of the plurality of alignment patterns including a first portion extending into a lower surface of the pad insulation layer and a second portion extending away from the lower surface of the pad insulation layer.