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公开(公告)号：US11523507B2
公开(公告)日：2022-12-06
申请号：US17267651
申请日：2019-08-09
Applicant: Samsung Electronics Co., Ltd. , SI FLEX CO., LTD.
Inventor： Sungwon Park , Junghyub Kim , Hwanyoul Jeong , Seungyup Lee , Youngsun Lee , Hesuk Jung , Eunseok Hong
Abstract: Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent. According to one embodiment, a connection member may be provided, the connection member comprising, a first conductive layer including a first logic line, and a second conductive layer in contact with the first conductive layer and including a bonding sheet layer, wherein the second conductive layer includes, a second logic line formed on part of the second conductive layer, and an RF line formed on other part of the second conductive layer, the bonding sheet layer includes, the second conductive layer adhered over the second logic line and the RF line, a first insulating layer formed between the first conductive layer and the second conductive layer, and pins formed on one side of the first conductive layer and the second conductive layer and configured to be electrically connected to connection pins of an external module, and the second conductive layer includes at least one via formed between the second logic line and the RF line so as to energize between the layers included in the second conductive layer. Such a flexible connection member may vary according to embodiments, and an electronic device comprising the flexible connection member may be provided according to various other embodiments.
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公开(公告)号：US10827607B2
公开(公告)日：2020-11-03
申请号：US16284619
申请日：2019-02-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungwon Park , Seungyup Lee , Hesuk Jung
Abstract: An electronic device includes first printed circuit board (PCB) structure including first layer including first conductive strip, second conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, and third conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, such that first conductive strip is between second conductive strip and third conductive strip, and second layer including first conductive layer, first insulating layer interposed between and in contact with first region of first layer and first region of second layer facing first region of first layer, second insulating layer interposed between second region of first layer abutting first region of first layer and second region of second layer abutting first region of second layer while contacting first layer, and third insulating layer interposed between second insulating layer and second region of second layer, while contacting second layer, and being separated from second insulating layer by air gap, and a wireless communication circuit electrically connected to first conductive strip and configured to transmit and/or receive radio frequency (RF) signal.
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公开(公告)号：US20190269009A1
公开(公告)日：2019-08-29
申请号：US16284619
申请日：2019-02-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungwon Park , Seungyup Lee , Hesuk Jung
Abstract: An electronic device includes first printed circuit board (PCB) structure including first layer including first conductive strip, second conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, and third conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, such that first conductive strip is between second conductive strip and third conductive strip, and second layer including first conductive layer, first insulating layer interposed between and in contact with first region of first layer and first region of second layer facing first region of first layer, second insulating layer interposed between second region of first layer abutting first region of first layer and second region of second layer abutting first region of second layer while contacting first layer, and third insulating layer interposed between second insulating layer and second region of second layer, while contacting second layer, and being separated from second insulating layer by air gap, and a wireless communication circuit electrically connected to first conductive strip and configured to transmit and/or receive radio frequency (RF) signal.
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