公开(公告)号：US20190139921A1

公开(公告)日：2019-05-09

申请号：US16030272

申请日：2018-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nam Gyu BAEK ,  In Young LEE ,  Hyun Soo CHUNG ,  Ho Geon SONG

IPC: H01L23/00

Abstract: A semiconductor device includes a substrate, a contact pad arranged in the substrate, a bump arranged on the contact pad to be electrically connected with the contact pad, an insulating film arranged on the substrate to surround a side surface of the bump and to expose at least a portion of the contact pad to the bump, and a photosensitive film which is formed on the insulating film and comprises a polyimide, wherein the photosensitive film comprises a first region surrounding the side surface of the bump and having a first thickness measured in a vertical direction, and a second region arranged on the first region and having a second thickness thickermeasured in the vertical direction, wherein the second region is spaced apart from the bump in a horizontal direction, and wherein the second thickness is greater than a thickness two times thicker than a difference value between the second thickness and the first thickness.