公开(公告)号：US20230230864A1

公开(公告)日：2023-07-20

申请号：US17894371

申请日：2022-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngon OH ,  Youngcheol JANG ,  Jihun KIM ,  Sanghyuk PARK ,  Sangho YOON ,  SeungYeob LEE ,  Chul Min LEE ,  Hochan LEE ,  Jaegyun JEON ,  Jeongkwan JUNG ,  Hyeong Seok CHOO ,  Dongyeol HAN

IPC: H01L21/677

CPC classification number: H01L21/67733 ,  H01L21/67706 ,  H01L21/67724

Abstract: A semiconductor fabrication facility including raceways on a ceiling of a structural construction and extending in one direction, a vehicle rail assembly coupled to the raceways, outer jig rails on outer sidewalls of the raceways and adjacent to the vehicle rail assembly, and an outer jig on the outer jig rails and configured to allow the vehicle rail assembly to move along the outer jig rails may be provided.