公开(公告)号：US09526162B2

公开(公告)日：2016-12-20

申请号：US14104266

申请日：2013-12-12

申请人： Samsung Electronics Co., Ltd.

发明人： Min-Su Jung ,  Sang-Hyeon Kim ,  Young-Tae Kim ,  Hong-Beom Kim ,  Il-Sung Jeong

IPC分类号： H05K9/00 ,  H05K1/02 ,  H04M1/02 ,  H05K3/30

CPC分类号： H05K1/0216 ,  H04M1/0277 ,  H05K3/301 ,  H05K2201/10159 ,  H05K2201/10371

摘要： A board assembly includes: a circuit board; a shield member coupled to the circuit board to face the circuit board; and at least one socket for a storage medium which is mounted on the circuit board. The shield member includes an opening that exposes the entirety of the socket to the outside. The board assembly forms an opening in a dual recess structure to accommodate the socket. Thus, the board assembly may contribute to the reduction of the thickness of an electronic device while being stacked with a battery. Further, the entire socket is exposed to the outside of the shield member, the storage medium may be easily removed.

摘要翻译： 板组件包括：电路板; 耦合到所述电路板以面对所述电路板的屏蔽构件; 以及至少一个用于安装在电路板上的存储介质的插座。 屏蔽构件包括将整个插座暴露于外部的开口。 板组件形成双凹槽结构中的开口以容纳插座。 因此，板组件可以有助于在与电池堆叠的同时减小电子设备的厚度。 此外，整个插座暴露于屏蔽构件的外部，可以容易地移除存储介质。