公开(公告)号：US20200267863A1

公开(公告)日：2020-08-20

申请号：US16794830

申请日：2020-02-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hosu KIM ,  Jongchun WEE ,  Kyungpil KIM ,  Namjun KIM

IPC: H05K5/06 ,  H05K1/18 ,  H05K1/02 ,  H05K5/00 ,  H04M1/02

Abstract: An electronic device is provided, which includes a housing including a sidewall; a through-hole configured to penetrate the sidewall; an assembling hole formed adjacent to the through-hole inside the housing; a key assembly configured to be received in the assembling hole and disposed to face an inner surface of the housing in an area where the through-hole is positioned; and a fixing member configured to be received in the assembling hole and to bring a surface of the key assembly into close contact with the inner surface of the housing around the through-hole and seal between the through-hole and an inner space of the housing.