公开(公告)号：US20150084097A1

公开(公告)日：2015-03-26

申请号：US14312702

申请日：2014-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sooyeon JEON ,  Rwik SENGUPTA ,  Chulhong PARK ,  Kwanyoung CHUN ,  Yusun LEE ,  Hyun-Jong LEE

IPC: H01L27/118

CPC classification number: H01L27/11807 ,  H01L27/0207 ,  H01L2027/11861 ,  H01L2027/11881

Abstract: A semiconductor device includes a substrate on which a plurality of logic cells are provided, and a plurality of active portions provided on the substrate and extending in a first direction. Contacts and gate structures extend in a second direction intersecting the first direction and are alternately arranged. A common conductive line extends along a boundary region of the plurality of logic cells in the first direction. At least one of the contacts is electrically connected to the common conductive line through a via therebetween, and each of the contacts intersects a plurality of the active portions. End portions of the contacts are aligned with each other along the first direction.

Abstract translation: 半导体器件包括其上设置有多个逻辑单元的基板和设置在基板上并沿第一方向延伸的多个有源部分。 触点和栅极结构在与第一方向相交的第二方向上延伸并且交替地布置。 公共导线沿第一方向沿多个逻辑单元的边界区域延伸。 至少一个触点通过它们之间的通孔电连接到公共导线，并且每个触点与多个有源部分相交。 触点的端部沿着第一方向彼此对准。