公开(公告)号：US11056827B2

公开(公告)日：2021-07-06

申请号：US16713444

申请日：2019-12-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghyun Yeo ,  Minyoung Kwon ,  Jungmin Lee ,  Hyunsu Lee ,  Hyunsuk Choi

IPC: H01R13/62 ,  H01R12/78 ,  H01Q1/24 ,  H03H7/38

Abstract: An electronic device is disclosed. The device includes a housing, a first printed circuit board (PCB) disposed in the housing and to including a first connector and a grip sensor, a second PCB disposed separate from the first PCB and including a second connector, an electrical path electrically coupled to the first connector and the second connector, at least one antenna forming part of the housing or disposed within the housing, a processor operatively connected to the grip sensor and the at least one antenna, a first conductive path electrically coupled to the grip sensor and the at least one antenna, and a second conductive path electrically coupled to the grip sensor and the first connector.