公开(公告)号：US10698367B2

公开(公告)日：2020-06-30

申请号：US16115683

申请日：2018-08-29

申请人： Samsung Electronics Co., Ltd.

发明人： Sung-Eun Park ,  Jong-Chun Wee ,  Wook-Jin Lee ,  Jae-Uk Ahn

IPC分类号： H05K5/06 ,  G04B37/08 ,  G04G17/02 ,  H04R1/44 ,  G04G17/08 ,  G04G17/04 ,  G04G13/00 ,  H04R1/02 ,  H04R1/10

摘要： An electronic device is disclosed including a housing including an outer wall, an inner, and a first through hole formed in the inner space, an audio module located in the inner space, a support structure located in the inner space between the audio module and the first through hole and including a second through hole; and a waterproof structure located in the inner space between the support structure and the outer wall including a flexible gasket. The gasket may include an outer rim, a recess portion moveable between the first through hole and the second through hole, and a connection portion between the rim and the recess portion, including at least one opening around the recess portion, such that the opening and the second through-hole form a sound path between the audio module and the first through-hole in the absence of pressure from an external liquid.