公开(公告)号：US10964618B2

公开(公告)日：2021-03-30

申请号：US16529331

申请日：2019-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jang-woo Lee ,  Kyung-suk Oh ,  Yung-cheol Kong ,  Woo-hyun Park ,  Jong-bo Shim ,  Jae-myeong Cha

IPC: H01L23/367 ,  H01L25/18 ,  H01L23/31 ,  H01L23/373 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip attached to an upper surface of the first semiconductor chip, a silicon heat-dissipation body thermally connected to at least one of the first semiconductor chip and the second semiconductor chip, and a molding member configured to surround the first semiconductor chip and the second semiconductor chip and exposing an upper surface of the silicon heat-dissipation body.

公开(公告)号：US20200168522A1

公开(公告)日：2020-05-28

申请号：US16529331

申请日：2019-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jang-woo Lee ,  Kyung-suk Oh ,  Yung-cheol Kong ,  Woo-hyun Park ,  Jong-bo Shim ,  Jae-myeong Cha

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L23/00 ,  H01L25/18 ,  H01L21/56

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip attached to an upper surface of the first semiconductor chip, a silicon heat-dissipation body thermally connected to at least one of the first semiconductor chip and the second semiconductor chip, and a molding member configured to surround the first semiconductor chip and the second semiconductor chip and exposing an upper surface of the silicon heat-dissipation body.