公开(公告)号：US11363712B2

公开(公告)日：2022-06-14

申请号：US16844629

申请日：2020-04-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Manho Kim ,  Keonyoung Seo ,  Jongwan Shim ,  Kwangsic Choi ,  Jaemin Ryoo ,  Hwajoong Jung ,  Kihuk Lee

IPC: H05K1/02 ,  H05K1/11 ,  H05K5/00

Abstract: A flexible printed circuit board that includes a signal transmission part that is disposed in a first direction and that includes a signal line that transmits an electrical signal and a ground part disposed in a second direction. The ground part includes a conductive adhesive layer disposed in the first direction and the conductive adhesive layer includes a plurality of conductive balls having electrical conductivity. Various other embodiments are disclosed in the specification.