公开(公告)号：US10068878B2

公开(公告)日：2018-09-04

申请号：US15215583

申请日：2016-07-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-gyu Kim ,  Ji-sun Hong ,  Su-jung Hyung ,  Hyun-ki Kim ,  Hyun Lee

IPC: H01L29/40 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L21/56 ,  H01L25/10 ,  H01L23/31

Abstract: Provided are a printed circuit board (PCB) capable of blocking introduction of impurities during a molding process so as to reduce damage on a semiconductor package, a method of manufacturing the PCB, and a method of manufacturing a semiconductor package by using the PCB. An embodiment includes an apparatus comprising: a substrate body comprising an active area and a dummy area on an outer portion of the active area, the substrate body extending lengthwise in a first direction; a plurality of semiconductor units mounted on the active area; and a barrier formed on the dummy area, wherein the barrier extends in the first direction.