公开(公告)号：US09647166B2

公开(公告)日：2017-05-09

申请号：US14554363

申请日：2014-11-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsup Choi ,  Wonjong Yoo ,  Deshun Qu ,  Changho Ra ,  Xiaochi Liu ,  Seunghwan Lee ,  Jia Lee

IPC: H01L31/054 ,  H01L29/06 ,  H01L31/032 ,  H01L31/18 ,  H01L31/0224

CPC classification number: H01L31/18 ,  H01L31/022425 ,  H01L31/032 ,  H01L31/054 ,  Y02E10/52

Abstract: According to example embodiments, an electronic device includes a substrate, an insulating layer on the substrate, and a diode layer on the insulating layer. The diode layer includes a two dimensional (2D) material layer. The 2D material layer includes an N-type region and a P-type region. According to example embodiments, a method of manufacturing an electronic device includes forming an insulating film on a substrate, forming a 2D material layer on the insulating film, and dividing the 2D material layer into an N-type region and a P-type region.