公开(公告)号：US20210347098A1

公开(公告)日：2021-11-11

申请号：US17283888

申请日：2019-10-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changsu KIM ,  Sangsik NA ,  Rathore Pranveer SINGH ,  Youngjin Yl ,  Jongbae JEON ,  Donghyeon HWANG ,  Hangyu HWANG ,  Jinhyeong PARK ,  Youngik SON

IPC: B29C45/14 ,  H05K5/00 ,  H05K5/04

Abstract: A method for manufacturing an electronic device, according to one embodiment of the present invention, may comprise the operations of: inserting and injecting a polymeric material into a structure, which is a plate-shaped metal structure comprising a first surface and a second surface, the structure comprising: at least one opening penetrating the first surface and the second surface; and at least one recess having a first depth from the first surface and extending to have a repeating pattern selected from among a W-shape, a sawtooth shape, and a straight line shape, when viewed from above the first surface; and confirming that the recess is filled with the polymeric material. Various other embodiments are possible.